Ntu
Research Fellow (Semiconductor Advanced Packaging)
Location
NTU Main Campus, Singapore
Posted
3 weeks before
About This Role
Seeking a PhD candidate to lead the development and validation of a Cu/dielectric hybrid bonding flow for fine-pitch 3D integration at NTU, focusing on optimizing process windows and reliability testing.
Responsibilities
- Develop and run a Cu–Cu hybrid bonding flow for fine-pitch 3D integration.
- Optimize process windows (pressure/temperature/anneal/surface activation) to minimize contact resistance and voids.
- Characterize materials and interfaces using optical/profilometry, SEM/TEM, electrical probing.
- Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles.
- Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation.
- Collaborate with tool vendors/industry partners; build prototype stacks to evidence manufacturability.
Requirements
- PhD in Materials/ Microelectronics/ EEE/ or related.
- Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding; litho/etch/CMP/plasma/anneal).
- Characterization: optical/profilometry, SEM/TEM, XPS/AFM, electrical probing; DoE/statistics (Python/Matlab a plus).
- Strong documentation, safety discipline, and clear communication in English.
- Process integration & optimization; root-cause/failure analysis.
- Reliability mindset (design/interpret thermal & electrical stress tests).
- Collaboration with tool vendors/industry partners; concise reporting; ownership.