All Jobs/Research Engineer / Senior Research Engineer (PVD for Advanced Packaging) (APM/Thin Film), IME
A*STAR
A*STAR

Research Engineer / Senior Research Engineer (PVD for Advanced Packaging) (APM/Thin Film), IME

Institute of Microelectronics

Location

Singapore

Department

Institute of Microelectronics

Posted

2 months before

Full Job Description

Job Description

Job Responsibilities: 

  • Developing and optimizing Physical Vapor Deposition (PVD) module processes for advanced packaging applications.
  • Thin film property characterization and process issue troubleshooting.
  • Develop high performance film and yield improvement strategies.
  • Act as a subject matter expert and resource for colleagues in integration teams.
  • Work with Fab team in establishing statistical process control for thin film module.
  • Generate and present reports to both internal and external customers.

 Job Requirements:

  • Bachelor or Masters in Materials Science and Engineering, Physics, Electrical Engineering, or related fields.
  • 3+ years direct research or industry experience in PVD of CoZrTa and CoFeB is preferred.
  • Good understanding of thin film deposition techniques, yield improvement and thin film property characterization is desired.
  • Understanding of thin film deposition tool hardware is advantageous.
  • Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
  • Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
  • Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.