Location
Singapore
Department
Institute of Microelectronics
Posted
2 weeks before
About This Role
A*STAR seeks a Senior Research Engineer to drive advanced packaging integration by controlling back-end processes (backgrinding, dicing, molding) and ensuring high yield for industry transfer. This role bridges research with manufacturing realities in a fast-paced fab environment.
Responsibilities
- Operational engineering control of back-end processes (backgrinding, dicing, molding).
- Monitor KPIs like yield, uniformity, and defectivity; perform root cause analysis.
- Support electrical test operations and analyze data to identify failure modes.
- Enable research-to-manufacturing transition for scalable packaging flows.
- Collaborate with industry partners on advanced packaging and reliability validation.
- Optimize equipment performance and introduce new materials into the process.
Requirements
- Bachelor's+ in Mechanical, Materials, Electrical, or Chemical Engineering.
- 3-5 years experience in semiconductor packaging/testing.
- Hands-on exposure to backgrinding, dicing, and molding processes.
- Strong understanding of wafer thinning, singulation, and reliability concerns.
- Experience with yield analysis, SPC, DOE, and failure analysis methodologies.
- Proficiency in data analysis tools (e.g., JMP, Python, Excel).