Process Support Engineer (Advanced Packaging)

About This Role

A Process Support Engineer role at Applied Materials in Singapore, requiring a chemistry/physics background with 4-7 years of experience in advanced packaging and hybrid bonding, focusing on troubleshooting complex equipment issues and optimizing process conditions.

Responsibilities

• Provide high-visibility customer support through on-site installations and system diagnoses.
• Work closely with customers to develop leading-edge processes for advanced semiconductor chips.
• Create hypothesis experiments and design of experiments (DOE); analyze data with statistics; compile reports.
• Troubleshoot complex problems and resolve difficult process engineering issues.
• Communicate with internal stakeholders to achieve goals while building trust and establishing relationships.
• Serve as a resource for junior colleagues and lead small projects with manageable risks.

Requirements

• Bachelor's degree in chemistry, physics, materials engineering, electrical engineering, or optoelectronics.
• 4–7 years of experience in semiconductor process (Hybrid Bonding/Advanced Packaging is highly preferred).
• Strong interpersonal and communication skills to explain sensitive information.
• Ability to work in a fast-paced cleanroom environment.