HP

Silicon MEMS Fab Process Development Engineer (Coat/Develop)

HP
ElectronicsSingapore, South West, SingaporeOnsitePosted 2 weeks ago

About the role

Silicon MEMS Fab Process Development Engineer (Coat/Develop) role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

ElectronicsOnsiteEngineering

Key Responsibilities

  • Develop new photo polymer, photo resist coat and ramping up the processes to manufacturing stability.
  • Defining and characterize stable and manufacturable coat/develop process steps, following the product specification through DOE study, to guarantee the best process quality.
  • Lead new technology/process transfer from US to Singapore.
  • Lead long term convergence process with US technology development team.
  • Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested.

Requirements

  • Bachelors or Master's degree in Mechanical, Electrical, Electronics, Chemical or Materials Engineering.
  • Possess at least 3 years of experience in semiconductor wafer fab environment.
  • In-depth knowledge of cross technical disciplines, analytical skills and problem solving skills with a keen eye to details.
  • Advanced project management skills including time and risk management, resource prioritization, and project structuring.
  • Good analytical and problem-solving skills .
  • High degree of interpersonal skills and able to work both independently and with cross-functional teams.