Infineon Technologies

Senior Engineer New Product Introduction

Infineon Technologies
Integrated Device ManufacturingSingaporeOnsitePosted 3 weeks ago

About the role

Senior Engineer New Product Introduction role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

IDMOnsiteBE

Key Responsibilities

  • Key responsibilities in your new role Taking the role of Product and Package project owner in BE Singapore to interact with various stakeholders during project early milestone until final release(M8/A9/M9.5) to fulfil both timelines committed to customer, as well the capability of early ramp at BE final test Support early engineering activities and requests Execute the qualification and buyoff activities to support the release criteria in New Product Release Board at different milestones stages Coordinate and monitor of product safe launch activities Be the owner of Yield/first pass yield/OEE as critical productive KPIs during the SFLA and early Ramp stage.
  • Work proactively on yield/OEE optimization.
  • Drive production development efforts for new products: analyse and develop manufacturing functions, processes, capacities, and facilities needed for production Work closely with development team (BU/TE/TTI) and production sustaining team (OP/EE) in resolving issues of the manufacturing work flows Assist in resolving other issues (such as design, supplier issues etc.) with project team, foundries and assembly site.
  • Drive for creation and update of related documentation (test procedures, assembly instructions, specifications, checklists)

Requirements

  • Qualifications and skills to help you succeed Bachelor / Master
  • Degree in Engineering fields
  • Minimum 3 years of experience in production / manufacturing / sustaining engineering environment
  • Knowledge of product development cycle and milestone concepts
  • Knowledge of backend final test/IBIS testing operations , with understanding of equipment capability and hardware design principles
  • Knowledge of backend assembly and packaging process