About the role
Research Engineer focused on Temporary Bonding and Debonding processes for advanced semiconductor packaging.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Developing and optimizing temporary bonding and debonding processes for wafer-level packaging.
- Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding.
- Investigate and resolve process issues and defects such as voids, warpage, and delamination.
- Plan and execute Design of Experiments (DOE) for process development.
- Collect, analyze data, and document findings in technical reports.
Requirements
- Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
- Experience in TBDB process development or advanced packaging technologies is an advantage.
- Strong analytical and problem-solving abilities.
- Good communication and teamwork skills.
- Ability to work in a cleanroom environment and handle precision equipment.