About the role
Scientist/Senior Scientist (PECVD Module for Advance Packaging) (APM), IME role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for advanced packaging applications.
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.
Requirements
- PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields.
- 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
- Good understanding of thin film deposition techniques and thin film property characterization is desired.
- Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired.
- Understanding of thin film tool hardware is advantageous.
- Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous.