About the role
AMD's Heterogenous Technology Integration (HIT) team is seeking an experienced leader to establish its Singapore Advanced Packaging Lab. This multi-disciplinary lab will accelerate the development of advanced packaging technologies for AMD’s AI product portfolio. The role involves enabling and maintaining metrologies,
FablessOnsiteEngineering
Key Responsibilities
- Build and lead a multidisciplinary team to establish and scale advanced measurement and characterization capabilities.
- Drive characterization of optical interconnects at component and channel level.
- Lead characterization of passives (capacitors, inductors).
- Identify and partner with external labs, equipment vendors, universities, and industry collaborators.
- Support simulation, physical design, and other lab-related activities.
- Interface with Asia-based manufacturing partners.
Requirements
- Direct experience managing and scaling technical teams.
- Strong network within the Singapore tech ecosystem.
- Hands-on experience in one or more technical areas (optical, electrical, mechanical, thermal, imaging).
- Strong presentation skills to engage and influence US-based partner teams.
- Proven track record of working with equipment suppliers to develop innovative instruments and metrologies.
- Familiarity with leveraging agentic AI to drive productivity.