About the role
Mechanical and Thermal Analysis of Advanced Packaged Devices Intern role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
FablessOnsiteStudent / Intern / Temp
Key Responsibilities
- Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.
- Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.
- Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.
- Present findings to internal stakeholders and participate in technical discussions.
- Continuously refine experimental procedures and maintain clear documentation.
- As an AMD [intern/co-op] , you'll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers.
Requirements
- Do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide.
- Whether you're an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
- Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.
- Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.
- Able to work independently, has a good work attitude and willing to learn.
- Should have good communication and presentation skills.