About the role
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- Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC).
- You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.
- These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more.
- You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.
- Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, etc.
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.