About the role
Scientist/Senior Scientist at A*STAR IME leading R&D on thermal management and advanced cooling solutions for next‑generation semiconductor packages, including AI/HPC, chiplet, 2.5D/3D, photonics, and power electronics.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Execute thermal engineering tasks for grant and customer‑funded R&D projects, manage timelines, experiments, and reporting.
- Perform package thermal assessments, identify hotspots, and generate technical data, reports, and presentations.
- Conduct thermal modelling and simulations using ANSYS Icepak, ANSYS Fluent, COMSOL Multiphysics, and Siemens Flotherm, including steady‑state, transient, junction temperature prediction, and thermal resistance extraction.
- Develop and validate new cooling concepts such as microchannel cooling, vapor chamber integration, immersion cooling, and high‑performance TIMs; build prototypes and conduct proof‑of‑concept testing.
- Perform laboratory thermal measurements with IR thermography, thermocouples, thermal transient testing, and flow/pressure drop testing; correlate experimental data with simulation results.
- Collaborate with package
Requirements
- PhD / master's degree in mechanical engineering, materials science, electrical engineering, microelectronics, thermal sciences and related disciplines.
- 2+ years' work experience in thermal management for semiconductor packaging preferred.
- Strong background in semiconductor package thermal design, electronics cooling, CFD / thermal modeling, experimental thermal characterization and materials for heat dissipation Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows and AI/HPC package challenges Experience in simulation tools and data analytics.
- Familiarity with JEDEC standards is advantageous.
- Strong communication and technical presentation skills.
- Strong industry engagement mindset.