About the role
The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a Scientist/Senior Scientist to advance chip-to-wafer and wafer-to-wafer hybrid bonding processes, develop fabrication techniques for 2.5D and 3D packaging, and conduct electrical and reliability characterization.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
- Lead high-impact projects with manageable risks and mentor less experienced colleagues.
- Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
- Research and develop advanced packaging technology such as flip-chip & hybrid bonding techniques for 2.5D and 3D IC applications.
- Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
- Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
Requirements
- PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
- 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
- Knowledge in hybrid bonding or flip chip bonding is a plus.
- Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable.
- Strong analytical and problem-solving skills.
- Proficiency in data analysis and interpretation and design of experiments.