About the role
Research Engineer role at NSTIC focusing on heterogeneous integration and BEOL process development for silicon photonic devices, including chemical cleaning, CMP, dicing, backgrinding, and die-to-wafer bonding.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop, design, and optimize die-to-wafer bonding process employing III-V semiconductor material, Lithium Niobate on Insulator (LNOI), and Si-based material platforms
- Design of experiments (DOE) for various die-to-wafer bonding methodologies
- Liaise between design, fabrication, and testing teams to ensure smooth process integration and device fabrication
- Perform metrology, data analysis, and documentation
- Present and discuss experimental data to the team
Requirements
- Degree in Electronics Engineering, Microelectronics, Physics, Chemistry, or equivalent
- Experience in semiconductor industry preferred, particularly with wafer-to-wafer and die-to-wafer bonding processes
- Good critical thinking and problem‑solving ability
- Ability to work with cross‑functional teams and strong communication/presentation skills
- Ability to work in a fast‑paced and collaborative environment