About the role
Develops and optimizes ALD and PECVD processes for GaN devices, characterizes thin film properties, provides expert support to integration teams, collaborates with fab teams on SPC implementation, and prepares technical reports and presentations for internal and external stakeholders.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop and optimize Atomic Layer Deposition (ALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes for GaN Devices.
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.
Requirements
- Ph.D in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or Microelectronics, or related fields.
- 3+ years direct experience in semiconductor thin film module, preferably in ALD and PECVD modules.
- Good understanding of thin film deposition techniques and thin film property characterization (desired).
- Hands‑on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem‑solving methods (desired).
- Understanding of thin film tool hardware (advantageous).
- Hands‑on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry (advantageous).