About the role
Research Engineer /Senior Research Engineer - Process Integrator / Hybrid Bonding/ HI role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization.
- The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
- Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
- Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
- Conduct engineering experiments for process characterization to drive quality and yield improvements.
- Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
Requirements
- Qualifications and Skills
- Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
- Technical Expertise: Hands-on experience in flip chip bonding is preferable
- Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
- Skills: Strong analytical and problem-solving skills.
- Proficiency in data analysis and interpretation and design of experiments.