About the role
Research Engineer (Heterogeneous Integration), (IME) role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging.
- Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics, essential for the next generation of heterogeneous chiplet integration.
- At IME, you'll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.
- Position Overview: We are seeking a highly skilled and motivated Research Engineer to drive the development and optimization of advanced wafer level packaging processes.
- This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.
- Innovative Process Development: Lead the design and development of advanced assembly processes, including 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
Requirements
- Educational Background: Master's or Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
- Experience: Hands-on experience in process development or packaging R&D.
- A proven track record in advanced packaging technologies will be an added advantage.