About the role
The role focuses on developing and optimizing PVD processes for advanced packaging thin‑film applications, including characterization, yield improvement, statistical process control, and reporting, while providing expertise to integration and fab teams.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop and optimize Physical Vapor Deposition (PVD) module processes for advanced packaging applications
- Characterize thin‑film properties and troubleshoot process issues
- Develop high‑performance film and yield improvement strategies
- Act as subject‑matter expert and resource for integration teams
- Collaborate with Fab team to establish statistical process control for thin‑film modules
- Generate and present reports to internal and external customers
Requirements
- Bachelor or Master's degree in Materials Science and Engineering, Physics, Electrical Engineering, or related fields
- 3+ years of direct research or industry experience in PVD of CoZrTa and CoFeB (preferred)
- Good understanding of thin‑film deposition techniques, yield improvement, and property characterization
- Understanding of thin‑film deposition tool hardware (advantageous)
- Hands‑on experience with process characterization techniques such as SEM, TEM, EDX, SIMS, FTIR, XPS, ellipsometry (advantageous)
- Strong interpersonal and oral/written communication skills