About the role
Develop and optimize PECVD processes for advanced packaging and photonics, characterize thin film properties, support integration teams, implement SPC, and deliver technical reports and presentations.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for Advanced Packaging and Photonics applications.
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.
Requirements
- Bachelors/Masters in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or Microelectronics (or related fields).
- 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
- Good understanding of thin film deposition techniques and thin film property characterization (desired).
- Hands‑on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem‑solving methods (desired).
- Understanding of thin film tool hardware (advantageous).
- Hands‑on experience with basic process characterization techniques such as DRSEM, HRTEM and Ellipsometry (advantageous).