About the role
The R&D Process Engineer (Etch Packaging) will design, execute, and analyze complex process engineering experiments, develop and implement new etch and packaging technologies, generate documentation, and collaborate with customers and vendors to solve semiconductor manufacturing challenges.
EquipmentOnsiteEngineering
Key Responsibilities
- Design, collect data, analyze and compile reports on complex process engineering experiments for multiple products within safety guidelines.
- Utilize techniques to characterize hardware, define methods, apply new technologies, and perform hardware characterization on complex systems.
- Generate internal and external documentation, presentations, technical reports, and process engineering specifications.
- Develop, plan, and execute process engineering projects.
- Train engineers in measurement techniques of film properties, guide data interpretation, new methodologies, troubleshooting, and resolve complex process engineering issues.
- Interact with customers to resolve complex process engineering issues with limited supervision.
Requirements
- PhD, Master, or Bachelor in Materials Science, Chemical Engineering, Chemistry, Physics, or related field.