About the role
Applied Materials is seeking an Advanced Packaging Process Integration Principal/Staff Engineer to develop cutting-edge advanced packaging process technologies for Mobile, IoT, Consumer, and High-Performance Computing markets. The role involves developing 2.5D/3D process technologies, managing wafer lots, performing data analysis, and driving technical programs to completion.
EquipmentOnsiteEngineering
Key Responsibilities
- Develop 2.5D/3D process technologies and solutions for Advanced Packaging including Bump/Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
- Plan wafer splits/lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
- Process and manage wafers/lots through integrated lines/process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
- Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
- Owns, manage, and drive technical programs/project, report out timely status and interface with various stakeholders/management leading to completion.
Requirements
- At least 7 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/Back-end of Line/Packaging or Assembly.
- Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
- Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
- Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
- Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
- Demonstrate ability, experience, and good communication skills to work across different functions/unit process owners and geographies to achieve technical outcome.