About the role
R&D Engineer Adv Tech Dev (PKE) / Sr. Staff role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
FablessOnsite
Key Responsibilities
- Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (5nm, 3nm, 2nm and beyond)
- Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000sW+) of advanced node cutting edge silicon products Research, develop, and productize new materials such as TIM, build-up-film, underfill etc.
- In support advanced node silicon (5nm & 3/2nm)
- POR definition Manage IC packaging activity from concept through development, qualification and high volume production Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology Implement, fine-tune, and productize newly developed technologies into HVM Create package design documentation and assembly instructions Work close with QA and customers to resolve quality issues Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp Interface with other operations functional groups such as product engineering, foundry, test, and QA Participate in package technology development and/or other business productivity projects which have broad team impact (e.g.
- Assembly process enhancement, new TIM material development etc.)
- Interface with tier #1 external customers for custom ASIC programs or as needed for development support, quality and/or other issue resolution Support NPI bring-up, pkg qual, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needs Job Requirements Education: BS/MS/PHD in STEM/Material Science/Electrical/Mechanical Engineering Experience: BS +8 years of experience or MS +6 years of experience or PhD + 3 years of experience is required Deep understanding of signal integrity and power integrity concepts such as characteristic impedance, s-parameters (RL, IL, FEXT/NEXT etc.), power plane impedance profile requirements and optimization etc.
Requirements
- Manage IC packaging activity from concept through development, qualification and high volume production
- Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology
- Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp
- Experience: BS +8 years of experience or MS +6 years of experience or PhD + 3 years of experience is required
- Familiarity with wafer BEOL as related to CPI (top metal, AP, passivation, UBM, bumping etc.)
- Knowledge of advanced substrate manufacturing/process is a must (e.g.