About the role
Substrate Engineer role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
FablessOnsite
Key Responsibilities
- Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
- Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
- Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity
- Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
- Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
- Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
Requirements
- Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemicalor Electrical).
- 8 years' experience in IC substrate manufacturing technologies and processes.
- Direct process and operational experience in a substrate manufacturing operations line is required.
- Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
- Direct process and operational experience in manufacturing environment
- Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable