About the role
Sr. Manager, Package Design/Development Quality Assurance role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteQuality
Key Responsibilities
- A highly specialized engineering team responsible for enabling the successful introduction of Micron's most advanced package technologies. This role is central to ensuring that chip‑package interaction risks, reliability concerns, and customer integration challenges are identified and mitigated early—before they impact product qualification, customer deployment, or field performance. You will work closely with Technology Development, Design, Assembly, and customer‑facing teams to drive deep technical understanding of package‑level failure mechanisms, define robust characterization and reliability strategies, and guide critical engineering trade‑offs. Beyond execution, this role offers the opportunity to shape next‑generation package technology by driving lessons learned into future designs, influencing industry practices, and publishing technical work that advances Micron's leadership position. Success requires a leader who can combine technical authority, people leadership, and cross‑functional influence to deliver both near‑term results and long‑term technology impact. Responsibilities and Tasks Technical & DDQA Leadership
- Lead DDQA strategy for new package technology introductions, with focus on CPI and customer integration risks
- Drive early identification and mitigation of package‑level reliability and interaction risks
- Define and oversee characterization and reliability test strategies
- Guide development of fundamental understanding of package‑related failure mechanisms
- Ensure effective root cause analysis and closure of package technology quality issues
Requirements
- This role is central to ensuring that chip‑package interaction risks, reliability concerns, and customer integration challenges are identified and mitigated early—before they impact product qualification, customer deployment, or field performance.
- Experience 10+ years of experience in one or more of the following areas: •Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure Analysis
- Qualifications •Demonstrated ability to lead and develop senior technical engineers •Strong knowledge of semiconductor package assembly and surface‑mount processes •Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability •Working knowledge of industry reliability test methods, acceleration models, and sampling statistics •Experience applying FMEA and structured problem‑solving methodologies (e.g., 8D) •Strong analytical skills with the ability to translate complex data into clear technical decisions •Proven ability to collaborate across functions and influence outcomes in complex technical environments
- Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
- However, all information provided must be accurate and reflect the candidate's true skills and experiences.