About the role
Senior/Staff/Principal - Adv Pkg TD Integrator role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteHIG
Key Responsibilities
- Developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch
- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
- Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
- Qualify new process/technology/equipment/materials Technical capability
- Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
Requirements
- The ability to enable best technology for New Technode with packaging requirements.
- Drive & collaborate with cross functional teams to resolve process related problems.
- Ensure smooth transition from new process development, 1st qualification success to small volume production launch
- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
- Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.