About the role
Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability) role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteHIG
Key Responsibilities
- As the key talent within High Bandwidth Memory (HBM)
- Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron's latest HBM products.
- Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI's Quality, Cost and Cycle Time.
- Play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing.
- This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards.
- Collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science, or a related field, or equivalent experience.
- Product or Test Engineering experience is preferred.
- Strong knowledge of coding / programming languages such as Python / C++ is a must.
- Proven experience in reliability engineering or a related role.
- Demonstrating Strong Technical Skills, especially in problem solving with root cause understanding and solution space.
- Attention to detail.