About the role
Snr/Staff Equipment Development Engineer (APTD) role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteHIG
Key Responsibilities
- Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
- Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
- Collaborating with process development teams to develop innovative new solutions.
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
- Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production
Requirements
- Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
- Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred
- Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
- Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production
- Education and Experience.
- 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder