About the role
Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
- Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Effective communicator, able to collaborate across all levels
- People – Respect, develop, and empower others
Requirements
- Bachelor's or advanced degree in Engineering or Science is required
- Strong analytical, logical, and critical thinking skills
- Effective communicator, able to collaborate across all levels
- Growth mindset with a passion for continuous learning
- Internship or experience in the semiconductor industry is a plus
- Demonstrated leadership and a track record of impact are highly desirable