About the role
Senior Engineer, PD SG, Dry Etch, NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteSTPG
Key Responsibilities
- Rapid deployment of new NAND process technologies.
- Drive development efforts prior to device ramp Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.
- Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.
- Proactively identify exciting processes and work with Fabs to find viable solutions Drive process simplification initiative across cross-functional teams.
- Integrate best-known manufacturing methods into the early development phase of upcoming nodes
Requirements
- Collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.
- Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines
- PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background
- Ability to build and maintain relationships with cross-functional teams and vendors
- Excellent communication skills (written, verbal, and presentation).
- Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.