About the role
Staff Engineer, Package Development & Engineering role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteAssembly & Test
Key Responsibilities
- Technical Leadership & Program Execution Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
- Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
- Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.
- Governance & Operational Excellence Develop and enforce standardized methodologies for technical program management and pillar governance.
- Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
- Ensure compliance with internal governance models and customer technical requirements.
Requirements
- Bachelor's or Master's degree in Engineering, Materials Science, or related technical discipline.
- 8+ years of experience in semiconductor packaging, process integration, or technology development.
- Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
- Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
- Strong technical communication and leadership skills.
- Familiarity with Micron's PDE, CPI, and NPI frameworks.