About the role
Principal/Staff Engineer, PCVD Film Deposition, TD role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteSTPG
Key Responsibilities
- Develop andoptimizeadvanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) forcutting-edgedevice architectures Design and execute complex DOE experiments to improve process capability, uniformity, and reliability Perform in-depth root-cause analysis using advanced modeling and characterization techniques Collaborate with integration,other process areas,metrology, and equipment engineering teams to solve critical technical challenges Drive innovation in film deposition for improved performance, cost efficiency, and sustainability Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles Define technology roadmaps and lead strategic research initiatives.
- Generate intellectual property and influence future deposition technology directions Mentor junior engineers and lead multi-disciplinary technical projects
Requirements
- Master'sin Chemical Engineering, Materials Science, Electrical Engineering, Physics, or relatedfield Master with minimum 8yearsor PhD with minimum 5 years hands-on experience in advanced thin film deposition,characterizationor related semiconductor field