About the role
Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteSTPG
Key Responsibilities
- , but are not limited to: Program and Project Management
- Manage efforts and set the strategy for developing process technology for assigned products in Process R&D.
- Offer routine project coordination and technical support to your process development team.
- Handle the demands of several customers to determine priorities for your team.
- Resolve yield and defect issues related to your process area.
- Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals.
Requirements
- At least five years of experience leading a process development team in a semiconductor R&D or high-volume manufacturing environment.
- Comprehensive understanding of Plasma Dry Etch Technology.
- Knowledge and experience in high aspect ratio etch development.
- Demonstration of collaborative ways of problem solving.
- Understand hard mask requirements based on material properties.
- Positive relationship building skills, both with internal and external customers.