About the role
Principal / Senior/ Engineer, Package Characterization - APTD role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures.
- You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development.
- Have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.
- Responsibilities and Tasks Conduct Electrical Characterization Understand PFA techniques available for de-processing failures Understand assembly and test process Perform electrical verification to confirm failures Establish best known method for de-processing package Provide Data Analysis Understand backend test flows, qualification methodologies and be able to pull relevant information Communicate with Internal/External Groups Document failure analysis techniques used to isolate failure for other groups Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs Provide Technical Expertise Conduct TMO training and FA certification Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
- Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
- Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
Requirements
- Understand backend test flows, qualification methodologies and be able to pull relevant information
- Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
- Education and Experience
- PhD, Master's, or Bachelor's degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.
- 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
- Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.