About the role
Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteFront End
Key Responsibilities
- Working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution. In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. Responsibilities and Tasks
- Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
- Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.
- Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
- Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
- Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50% Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
- The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.
- Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.
- Good multi-tasking, verbal, and written communication skills.
- Strong interpersonal skills and customer/co-worker relationships.
- Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.