About the role
Senior executive responsible for end-to-end program management of global payment programs within Global Wafer & Backend Global Manufacturing Technology Operations. Leads large-scale, multi-site initiatives that align payment strategies with semiconductor manufacturing supply chain objectives.
BankingOnsite
Key Responsibilities
- Own and drive the strategic roadmap and execution of global payment programs across GWBGMTO
- Lead cross-functional teams including finance, procurement, IT, legal, and operations to deliver complex payment solutions
- Establish program governance, KPIs, and reporting mechanisms to track performance and ensure on-time, on-budget delivery
- Identify and mitigate risks related to payment processing, compliance, and supply chain continuity
- Collaborate with senior executives and external partners to align payment initiatives with business objectives
- Drive continuous improvement and standardization of payment processes across global manufacturing sites
Requirements
- Bachelor's degree in engineering, business, or related field; MBA or advanced degree preferred
- 15+ years of progressive program management experience in high-tech or semiconductor manufacturing environments
- Proven track record of managing large-scale, global programs with budgets exceeding $50M
- PMP certification required; Six Sigma Black Belt preferred
- Deep understanding of semiconductor supply chain and manufacturing operations
- Strong financial acumen and experience managing complex budgets and cost models
- Exceptional leadership and stakeholder management skills at the executive level
- Experience with ERP and MES systems in a manufacturing context
- Ability to travel up to 25% globally
- Excellent communication skills in English; additional languages a plus