Micron Technology

Engineer, Package Health Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 7 months ago

About the role

Engineer, Package Health Engineering role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

IDMOnsiteHIG

Key Responsibilities

  • The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities.
  • This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
  • Develop and implement DFT strategies for advanced packaging.
  • Conduct simulations for mechanical, thermal, and electrical performance.
  • Perform electrical and mechanical characterization of packages.
  • Analyze test and field data to identify early indicators of package degradation.

Requirements

  • Bachelor's or advanced degree in Engineering or Science is required
  • Strong analytical, logical, and critical thinking skills
  • Effective communicator, able to collaborate across all levels
  • Growth mindset with a passion for continuous learning
  • Internship or experience in the semiconductor industry is a plus
  • Demonstrated leadership and a track record of impact are highly desirable