About the role
Package Health - Principal/Staff/Senior Engineer, Advanced Packaging Technology Development role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteHIG
Key Responsibilities
- The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities.
- This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
- Develop and implement DFT strategies for advanced packaging.
- Conduct simulations for mechanical, thermal, and electrical performance.
- Perform electrical and mechanical characterization of packages.
- Analyze testand field data to identify early indicators of package degradation.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field.
- 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
- Hands-on experience with simulation tools and test equipment, working on package characterization, reliabilitytestingor electrical failure analysis.
- Proficiency in statistics, dataanalysisand scripting (e.g., Python, MATLAB, JMP).
- Strong understanding of semiconductor packagingprocess, materialinteractionand properties.
- Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes.