Micron Technology

Senior Manager/ Manager, Advanced Packaging Technology Development - Package Integration

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 8 months ago

About the role

Senior Manager/ Manager, Advanced Packaging Technology Development - Package Integration role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

IDMOnsite

Key Responsibilities

  • The package integration department to enable deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects. Key responsibilities and duties include: Develop and Communicate Advanced Packaging Technology Development Strategy
  • Develop and communicate Advanced Packaging Technology Development strategic objectives
  • Understand the impact and implications of APTD strategy to the overall company strategy and direction Technical Leadership
  • Set fiscal year technical objectives and insure they are aligned with department objectives
  • Demonstrate understanding of technology complexity and effective technology decision making
  • Provide technical leadership that may influence company direction Multi-Functional Leadership

Requirements

  • (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Consistent track record to solve problems and address root causes Ability to multi-task and manage numerous projects simultaneously Tenacity to work effectively under timelines and limited resources Validated ability to lead small and large teams, directly or indirectly, toward common goals Outstanding communication and presentation skills, written and verbal to all levels of an organization About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .