Micron Technology

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 6 months ago

About the role

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

IDMOnsiteHIG

Key Responsibilities

  • Identify, diagnose, and propose yield related breakthroughs.
  • Have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
  • Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
  • Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
  • Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Requirements

  • (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team Ability to resolve complex issues through root-cause or model-based problem solving Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .