Micron Technology

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 8 months ago

About the role

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.

IDMOnsiteHIG

Key Responsibilities

  • Have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
  • Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
  • Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Requirements

  • (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .