About the role
Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- The DMTS is a top technical authority who shapeslong‑termwet process and chemistry strategy, drivesexternal‑facingtechnical insight into roadmap decisions, and expands Micron's competitive advantage through supplier exclusivity mechanisms and ecosystem collaboration.
- Expected to set direction across organizational boundaries, influencelong‑termtechnical investment priorities, andestablishexternal perspectives into internal roadmaps.
- MainResponsibilities Providevisionof futurepotential ofnew materials and methods from academic/consortium projects to guide roadmap solutionselection.
- Interact with equipment and materials suppliers to drive innovative technology development, ensure alignment/progress, and build productive strategic relationships.
- Identify, define, and drive SOW agreements to increase Micron exclusivity of equipment/chemistry/process solutions.
- Align process technology roadmaps across PD teams and resolvecross‑organizationallogistical issues.
Requirements
- Minimum Qualifications / Experience PhD≥15yrs, or Master's ≥17yrs, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, With extensivewet process development experience Deep understanding of memory technologies, semiconductor processing/devices, and strong ability to form internal/external collaborations.
- Strong record of technical contributions, publications, or patents in relevant domains Must ‑ haveTechnical Skills Strong understanding of process technology development business processes/strategy, surface science and analytic methods related to material properties, and rational risk assessment.
- Possess a deep understanding of the process technologies such as Vapor etch, wet strip, dry strip, selective chemical etching, etc.
- Familiarity with electrical evaluation methods andfabmetrology tools (e.g., CD‑SEM, thickness measurement, particle counters).
- DOE / SPC and data analysis systems (e.g., Y3)to analyzeexperimental outcomes.
- Working knowledge of memory process flow (planar + vertical NAND context).