About the role
Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.
- Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/materialutilization.
- Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration.
- Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).
- People– Respect, develop and empower others
Requirements
- Minimum Qualifications / Experience PhD≥5yrs, or Master's ≥7yrs, or Bachelor's ≥10yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Withdemonstratedexperience in Thin Films R&D/PD for NAND including CVD and Diffusion thin films Must-Have Technical Skills Mastery of thin film deposition (ALD/CVD) for high-density NAND applications
- Process design/optimization/integration.
- Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown).
- Proficiencyin SPC/DOE/data analytics for optimization and fixing.
- Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).
- Must-Have Soft Skills Technical leadership through influence