About the role
Senior Engineer – Process Development, Dry Etch NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- Perform advanced dry etch process development tasks including process window analysis, recipe optimization, and tool continuous improvement evaluation for 3D NAND technology.
- Collaborate with Process Integration and other process development areas (Wet Etch, CVD/Diffusion, Metals, Lithography, CMP) to develop and integrate solutions.
- Conduct root cause / failure mode analysis and work with vendors/suppliers where needed to close hardware/process gaps.
- Support pilot-line execution and process transfer activities as required by program needs.
- People– Respect, develop and empower others
Requirements
- Minimum Required Qualifications / Experience PhD, or Master's ≥3 yrs, or Bachelor's ≥5 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field Evidence of strong aptitude for technology development and experimental/data analysis work in a dry etch / semiconductor context.
- Must-have technical skills Fundamentals in dry etch processing and at least one of: thermodynamics, transport phenomena, kinetics, or plasma physics.
- DOE, statistics/SPC, and comfort with analysis tools.
- Must-have soft skills Structured problem-solving and ability to work independently with minimal direction.
- Cross-functional collaboration and clear written/verbal communication.
- Highly desirable / preferred Data science basics / Python scripting experience (helpful for analysis/automation).