About the role
Staff Engineer – Process Development, Dry Etch, NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
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Key Responsibilities
- Develop/optimize dry etch processes to meet physical/structural and electrical requirements for advanced NAND products.
- Lead root cause / failure mode analysis for process/hardware limitations and drive vendor/supplier engagement for solutions.
- Collaborate with Process Integration and adjacent process areas (Wet Etch, CVD/Diffusion, Metals, Lithography, CMP) to integrate solutions and resolve cross-module interactions.
- Support pilot-line sustainment and process transfer to manufacturing sites asrequired.
- Demonstrated experience in dry etch process development and experimental design/data analysis.
- Strong analytical problem-solving; ability to manage multiple technical priorities and deliver on commitments.
Requirements
- Minimum Qualifications / Experience PhD≥3 yrs, or Master's ≥5yrs, or Bachelor's ≥7yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Demonstrated experience in dry etch process development and experimental design/data analysis.
- Must-have technical skills Dry etch fundamentals
- Understanding of plasma physics/chemistry and reactor behavior.
- DOE/SPC and statistical analysis skills.
- Must-have soft skills Strong analytical problem-solving
- Ability to manage multiple technical priorities and deliver on commitments.