About the role
Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteSTPG
Key Responsibilities
- Lead development of dry etch technology and essential modules; serve as a dry etch area expert.
- Develop/innovate dry etch processes to meet structural and electrical specifications;demonstratemechanistic understanding of parameter-to-outcome relationships.
- Work closely with hardware teams to develop the equipment roadmap for current and upcoming NAND products.
- Lead multi-functional teams to solve complex structural problems; present technology development plans for current/upcoming nodes and build mitigation plans for future issues.
- Lead supplier head-to-heads; drive RCA, SPC,andcorrective actions to close gaps.
- People– Respect, develop and empower others
Requirements
- Minimum Qualifications / Experience PhD≥8yrs, or Master's ≥11yrs, or Bachelor's ≥13yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Advanceddryetch PD experience Must-have technical skills Deep plasmaetchfundamentals
- Reactor knowledge
- High aspect ratioetchscalability experience.
- DOE/SPC/statistics and model-based problem solving.
- Must-have soft skills Cross-functional leadership, mentorship mindset, and strong stakeholder communication.
- Highly desirable / preferred Data science basics / Python coding / AI-assisted analysis.