About the role
Senior Member of Technical Staff (SMTS) – Process Development, Cell Film, NAND role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
IDMOnsiteSTPG
Key Responsibilities
- The SMTS acts as a technical authority in 3D NAND cell film development, setting strategic direction and leading multi-functional initiatives to drive department-wide impact by architecting solutions, accelerating innovation adoption, influencing technical standards, and mentoring engineers to elevate technical excellence.
- Defines technical strategy and drives cross-org adoption
- Leadscomplexproblem solving across process/hardware/device interactions with no yield trade-off
- Builds the SME pipeline through structured mentorship.
- MainResponsibilities Define technical strategy
- Architect solutions
Requirements
- Minimum Qualifications / Experience PhD≥12yrs, or Master's ≥15yrs, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, Experience in Thin Film R&D for NAND, specifically in Diffusion, CVD, and Cell Film technologies Proventrack recordof architecting technical solutions & process-device correlation Publications/patents and strong record of technical contributions.
- Must-Have Technical Skills Deepexpertise in ALD/CVD thin film processing , including nitride/oxide systems, inhibitor chemistries, multi ‑ layerONO stacks , and barrier/protection layers, with proven ability to architect robust solutions for advanced 3D NAND integration.
- Hands ‑ onleadership experience in cell film hardware and equipment optimization , including precursor delivery, temperature control, chamber matching/segregation, batch vs.single‑wafertrade‑offs, and metrology hook integration.
- Strong command of process–device interactions, reliability modeling, and 3D NAND scaling , with the ability to correlate materials, structures, and electrical behavior to enable scaling and sustain yield.
- Expert use of advanced characterization techniques (SIMS, XPS, TEM, EDX/EELS, electrical stress testing) to drive root ‑ causeanalysis , window recovery, and predictive correlation models without yieldtrade‑offs.
- Proven ability to lead complex technicalproblem ‑ solving , mentor engineers, influencecross‑functionalteams and vendors, and build organizational capability through knowledge sharing and structured development.