About the role
Microelectronic Assembly Engineer role based on the published job description. Key responsibilities and requirements were extracted directly from the posting for quick review.
Defense R&DOnsiteAccounting
Key Responsibilities
- More than just a career. This is where you will make a real impact and shape the future of defence across the spectrum of air, land, sea, space and cyberspace. The Engineering Division conducts research and provides engineering services to the whole of DSO in the areas of digital and mixed- signal electronics/microelectronics, radio frequency (RF), electromagnetic interference (EMI)/electromagnetic compatibility (EMC), antennas, as well as mechanical and thermal engineering. People are DSO's greatest asset. You will get to realise your career aspirations and develop your own niche either as a deep technical expert or a leader in the team. With frequent career dialogues and a robust training and development framework, we will provide you with the necessary development tools for you to reach your potential. You will also be recognised and rewarded through competitive remuneration packages and scholarship opportunities. Engineer in Microelectronic Assembly In this role, you will:
- Conduct microelectronics assembly tasks such as die attachment and wire-bonding.
- Perform design for manufacturing and assembly checks on PCB designs.
- Coordinate with PCB vendors to oversee the fabrication of printed circuit boards.
- Diploma/ Bachelor's Degree in Electrical / Electronic Engineering / Electrical and Electronic Engineering
- Proficient in microelectronics assembly.
Requirements
- Diploma/ Bachelor's Degree in Electrical / Electronic Engineering / Electrical and Electronic Engineering • Proficient in microelectronics assembly.
- Certified in IPC-610C and J-Std-001, or familiar with IPC standards.