Location
Singapore
Department
Product Eng. NXP Non-Auto
Posted
1w ago
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Opens SSMC's careers page · Last scraped 30 May 2026
Job Description
What you will be working on Ensuring 1st time yielding silicon, benchmark D0 for baseline and products. Identify & resolve Product, Test & Fab-Process related yield limiters in shortest time possible. Technical interface with Business Lines/customers Driver for yield improvement Resolve product yield, quality and reliability issues Perform pre-tapeout risk assessment and communicate with Business line/Fab on the necessary actions to eliminate/minimize the risk. Work with Customers/Mother Fab on the DfM related issue. Conduct product yield analyses to identify root cause of wafer sort and final test failures Set up fault diagnostic capabilities for yield improvement Work with Business line/customers on product low yield disposition Perform electrical and physical failure analysis to isolate fail location Drive the yield improvement task force More about you Master/bachelor’s degree in electrical / Electronic Engineering or Science in Physics 2 – 8 years product and/or test engineering, failure analysis or process-integration experience Experience in Fab process, yield engineering or design will be an added advantage In depth knowledge of semiconductor device physics, electrical & electronics engineering fundamentals & wafer fabrication processes Strong analytical & problem-solving skills Good interpersonal and communication skills