Location
Singapore
Department
Institute of Microelectronics
Posted
2w ago
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Opens A*STAR's careers page Β· Last scraped 30 May 2026
Job Description
Job Description Responsibilities: Support the development of thin film deposition, etching, wet cleaning, wafer bonding and release process modules to enable the fabrication of innovative MEMS devices. Collaboration with process integration team to establish manufacturable fabrication procedures and perform basic process tuning. Work closely with the equipment engineering team to identify hardware issue and carry out basic troubleshooting of faulty equipment. Perform routine metrology measurements to monitor and ensure stable process performance. Requirements: Diploma or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields. 3 years of semiconductor or MEMS related working experience is advantageous. Experience in thin film deposition, etching, wet cleaning, wafer bonding or release process is desired. Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous. Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.