About the role
Lead and manage a wafer fab manufacturing engineering module focused on Wet Etch and Electroplating processes, overseeing a team of engineers and technicians, driving process excellence, yield improvement, equipment reliability, and compliance with EHS and quality standards.
FablessOnsiteHardware Engineering
Key Responsibilities
- Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
- Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment
- Drive excellence in output, quality, cost, equipment uptime, and safety
- Ensure robust process control, stability, and integration across wet etch and plating operations
- Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions
- Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis
Requirements
- Bachelor's degree in Engineering, Chemistry, Materials Science, Physics, or related discipline
- Minimum 10 years of relevant experience in semiconductor wafer fabrication
- Strong hands‑on technical expertise in Wet Etch, Electroplating, and related wet processes
- Prior experience in high‑volume semiconductor manufacturing within an MNC environment
- Strong understanding of process integration, Statistical Process Control (SPC), yield improvement and scrap reduction methodologies, and equipment maintenance strategies for wet benches and plating tools
- Proven people management experience, including coaching, talent development, succession planning, and